Equipment Technologies Inc

Pioneer-Dietecs Corp is a leading provider of specimen dies, custom cutting dies, die services, and die-cutting presses for medical and industrial applications. With a focus on precision and quality, their products meet the highest standards and exceed industry tolerances, ensuring enhanced sharpness and long die life. Their state-of-the-art CNC computerized measuring machine allows for precise die inspection and certification, guaranteeing consistent performance. With an easy online ordering system and personalized service, Pioneer-Dietecs Corp offers a wide range of dies, die-cutting presses, and accessories to meet various specifications. Their expertise in specimen die-cutting is complemented by their innovative Precision Edge technology, which improves die performance and longevity. As a trusted name in the industry, Pioneer-Dietecs Corp is dedicated to providing reliable solutions for die-cutting needs.Generated from the website

Founded in 1970, Parlex Corporation designs and manufactures flexible interconnect products. Utilizing proprietary processes and patented technologies, the company designs and produces custom flexible circuits, laminated cables, value-added assemblies and polymer film products for the automotive, telecommunications and networking, diversified electronics, aerospace and computer markets. The company s proprietary technologies include PALCon, PALCoat, PALFlex, PALCore HP and Polysolder. The company has regional offices, logistic support centers and strategic alliances located throughout North America, Asia and Europe. Parlex has manufacturing facilities located in San Jose, Calif.; Cranston, R.I.; Shanghai, China; Empalme, Mexico; Newport, United Kingdom; and Methuen, Mass.

Remtec was established in 1990 to serve a need in advanced ceramic packaging technology for the electronics industry, primarily for high-power and circuit density applications covering a broad frequency range. The company developed plated copper on to thick film ceramic metalization technology to meet this need. It has been involved in the design and fabrication of metalized ceramic boards, chip carriers, packages and specialty components for various electronic applications. In 1999, the company acquired a plating company with new equipment, including an automated cassette-to-cassette production line, which allowed it to position itself as one of the leading manufacturers of PCTF substrates, chip carriers, packages and specialty components. Remtec is headquartered in Norwood, Mass.