Polymer Assembly Technology (Pat)
Polymer Assembly Technology (PAT), founded in 2003 by industry veteran Jim Clayton, specializes in precision prototype and low-volume flip chip assembly services. The company focuses on fine-pitch imaging devices and temperature-sensitive components, providing innovative solutions for government and university research labs involved in advanced imaging applications.
PAT employs a proprietary stencil printing technique utilizing low-cost, low-temperature curing silver-filled conductive epoxies to achieve high-density flip chip interconnections. With over 45 years of experience in microelectronic assembly, PAT is committed to quality, technical improvement, and ethical standards in delivering microelectronic interconnect solutions.
Generated from the website


