Polymer Assembly Technology
Polymer Assembly Technology (PAT), founded in 2003 and led by industry veteran Jim Clayton, specializes in precision prototyping and low-volume flip chip assembly services. Their expertise extends to fine-pitch imaging devices and temperature-sensitive II-VI and III-V devices, including biomedical sensors and optical polymer-MEMS.
PAT employs innovative low-temperature curing silver-filled conductive epoxies and a proprietary stencil printing technique to achieve high-density flip chip interconnections. Committed to quality and ethical standards, the company collaborates with government and university research labs on advanced imaging technologies for various applications.
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