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QP Technologies, a division of Promex Industries, is a leading provider of microelectronic packaging and assembly services based in Escondido, CA. With a focus on delivering full turn-key solutions, they offer a range of services including wafer preparation, substrate design and development, and prototype and small-volume IC packaging and assembly. QP Technologies leverages their skilled staff and proven technologies to ensure high-quality products and quick time-to-market for their clients. With a commitment to sustaining and expanding their line of industry-leading packages and substrate capabilities, QP Technologies caters to various markets including automotive, commercial, compound semiconductors, industrial, medical, mil-aero, and power semiconductors. Their expertise in developing board and IC solutions using traditional leaded plastic packages, Open-cavity Plastic Packages (OCPP), and Open-molded Plastic Packages (OmPP) makes them an ideal choice for military-aerospace applications. Additionally, their custom packaging designs optimize functionality in power ICs, maximizing product lifecycles. QP Technologies is known for their exclusive OmPP line, offering pre-molded, air-cavity quad flat no-lead (QFN) packages in various sizes, suitable for prototype, mid-volume, or production volume applications.Generated from the website