Flip Chip International
Flip Chip International is the leading provider of bumping and wafer level services in North America, offering innovative solutions for the future of the industry. With a focus on health and safety, the company prioritizes the well-being of its employees, customers, and communities.
Specializing in flip chip, WLCSP Cu Pillar bumping, wafer probe testing, and die services such as wafer-dicing and inspection placement, Flip Chip International offers a comprehensive range of high-quality services to meet the needs of its clients. With a commitment to innovation and excellence, the company is dedicated to providing cutting-edge solutions for the semiconductor industry.
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