Xandex

Xandex provides equipment and materials used to fabricate, test, assemble and package integrated circuits. The company designs, manufactures, markets and services products and equipment for use in the testing of semiconductor devices, which are the technology drivers for computers, automobiles, telecommunications products and a vast array of consumer electronics. Its products and services enable semiconductor manufacturers to test the integrity of semiconductor devices while in batch wafer form or as packaged chips. The company's primary offerings are test interface design and manufacturing services for automated test equipment and high-speed DieMark inking systems used to mark defective devices at wafer level test for positive identification during latter assembly and packaging processes. Xandex products are distributed throughout North America and Europe from its Petaluma, Calif., headquarters.

Loomis Industries is a leading provider of precision scribe dicing machines, specializing in the cleaving and dicing of semiconductor lasers and wafers. With their extensive expertise in the field, they offer consulting services to help clients optimize production and achieve a measurable return on investment. Their innovative products, such as the LSD-155 and LSD-155Lt, combine automation, flexibility, and high accuracy to ensure consistent yields and clean, debris-free die starts. By employing patented technologies and custom-configured controlled-strain cleaving, Loomis Industries works closely with clients to develop processes that meet their unique application needs. Their precision scribe tool, designed for accurate scribing at the optimum angle, force, and speed, sets the foundation for efficient and reliable cleaving of various components, including laser diodes, optical detectors, transistors, and light emitting diodes. With a commitment to excellence, Loomis Industries continues to be a trusted expert and innovator in the field of scribing and cleaving technology.Generated from the website