Stats Chip Pac Inc
STATS ChipPAC is a leading provider of advanced integrated circuit manufacturing and technology services, offering a comprehensive array of turnkey solutions, including semiconductor package integration design, wafer probing, and package assembly. With a commitment to powering the future, the company excels in 2.5D and 3D systems integration, as well as various packaging technologies such as flip chip and wirebond packaging.
Specializing in high-demand applications across sectors like automotive, computing, and energy, STATS ChipPAC ensures that its innovative technologies meet the rigorous requirements of the global market. Their extensive capabilities also encompass MEMS sensor packaging, reaffirming their status as a trusted partner in the interconnected future of technology.
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