New Edge Components

Dynatex International is one of the leading companies in the world, which provides wafer and diode die separation products for semiconductor and related industries, providing fabless services, equipment and materials. The company s products include dry process scriber, hoops, frames, carriers, mylar overlays and diamond scribe tools. It provides solutions for separating die or diodes such as dry process dicing, wafer bonding system and wafer dicing system. Dynatex International provides manufacturers with wafer die separation and laser bar cleaving engineering solutions for both traditional wet saw applications and dry process dicing applications. It also offers specialty solvents formulated for particular applications to quickly de-bond adhesives and clean wafers. The various markets served by the company include telecommunications, biotech, aerospace, microelectronics, automotive and lighting.

Loomis Industries is a leading provider of precision scribe dicing machines, specializing in the cleaving and dicing of semiconductor lasers and wafers. With their extensive expertise in the field, they offer consulting services to help clients optimize production and achieve a measurable return on investment. Their innovative products, such as the LSD-155 and LSD-155Lt, combine automation, flexibility, and high accuracy to ensure consistent yields and clean, debris-free die starts. By employing patented technologies and custom-configured controlled-strain cleaving, Loomis Industries works closely with clients to develop processes that meet their unique application needs. Their precision scribe tool, designed for accurate scribing at the optimum angle, force, and speed, sets the foundation for efficient and reliable cleaving of various components, including laser diodes, optical detectors, transistors, and light emitting diodes. With a commitment to excellence, Loomis Industries continues to be a trusted expert and innovator in the field of scribing and cleaving technology.Generated from the website

Xandex provides equipment and materials used to fabricate, test, assemble and package integrated circuits. The company designs, manufactures, markets and services products and equipment for use in the testing of semiconductor devices, which are the technology drivers for computers, automobiles, telecommunications products and a vast array of consumer electronics. Its products and services enable semiconductor manufacturers to test the integrity of semiconductor devices while in batch wafer form or as packaged chips. The company's primary offerings are test interface design and manufacturing services for automated test equipment and high-speed DieMark inking systems used to mark defective devices at wafer level test for positive identification during latter assembly and packaging processes. Xandex products are distributed throughout North America and Europe from its Petaluma, Calif., headquarters.