Mirror Semiconductor, Inc.
Mirror Semiconductor Inc., located in Irvine, CA, specializes in open cavity QFN rapid prototyping products and assembly services, focusing on bonding wire sockets and various bonding wire types, including gold, aluminum, silver, and copper-palladium. Their M-QFN series features open cavity QFN packages designed for MEMS, RF sensor, and silicon applications, ready for die attach and wire bonding with compliance to JEDEC Standard MO-220.
The company offers a range of engineering solutions, including 40 open tooled packages and both flat and dome covers, along with QFN sockets that feature windows for probing into the cavity. Additionally, they provide CAD drawings in multiple formats to support design and development needs in the semiconductor industry.
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