Kinsus Corporation
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Kinsus Corporation is a leading provider of advanced semiconductor packaging solutions, with its headquarters located in Taoyuan City, Taiwan, and a subsidiary in Santa Clara, California. The company specializes in a variety of products including System-in-Package (SiP), Package Ball Grid Array (PBGA), Flip Chip CSP, and RF modules, catering to diverse industries globally.
With a commitment to quality and corporate governance, Kinsus emphasizes its dedication to sustainable practices through its ESG policies. The company has established multiple manufacturing facilities in Taiwan and China, ensuring a strong presence in the semiconductor market.
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