American Red Cross of Ventura County

Micro Materials Inc. specializes in semiconductor wafer temporary bonding, debonding, and device protection solutions, enabling advanced thin semiconductor manufacturing with higher yield and reduced cost. Their patented AirDebond technology allows for low-stress wafer debonding using air jetting, ensuring a cleaner, greener, and faster thin wafer handling experience. With a focus on innovation and efficiency, Micro Materials Inc. offers high-performance adhesive and coating solutions, as well as wafer bonding and debonding services for various industries including compound semiconductor, IC packaging, photonics, MEMS manufacturing, and flexible electronics fabrication.Generated from the website