Advanced International Technology
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Advanced International Technology LLC is a specialized provider of back-end wafer processing, micro-assembly, and fabrication services, focusing on prototyping and small to medium builds. With expertise in dicing services across various substrate materials, the company ensures high precision and engineering quality for its clients.
In addition to dicing, Advanced International Technology employs innovative wire bonding techniques, including wedge, ball, and die bonding, to facilitate custom microelectronics assembly. Their engineering and manufacturing solutions cater to diverse industries such as data storage, biotechnology, MEMS, and nanotechnology, helping clients realize exceptional product outcomes.
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