Kes Systems Inc

Founded in 1964, Lansdale Semiconductor is responsible for integrated circuit life cycle management. It manufactures commercial wireless, telecommunication, military and aerospace integrated circuits. The company manufactures more than 3,000 circuits in original package. Lansdale Semiconductor specializes in aftermarket technology manufacturing and supplies for discontinued semiconductors and integrated circuits. It operates accounting, engineering, human resources, information technology, marketing, quality assurance and sales departments. The company has a distribution partner Avnet Electronics Marketing.

SUMCO USA, founded in 1999, is one of the leading manufacturers of electronic-grade silicon wafers used in the semiconductor industry. The products offered by the company include epitaxial wafers, single crystal, polished wafers, and silicon ingots, used to make integrated circuits and semiconductor devices in electronic products, computers, cell phones, digital watches and automobile engines. The company offers various services, such as research and development of product applications, inventory maintenance and product delivery management. It also offers an Internet-based customer information system that provides access to status reports and detailed technical information about the products. SUMCO USA is headquartered in Phoenix, and has manufacturing facilities throughout the United States.

Since 1980, HDA/SMC has been providing a full-service contract manufacturing solutions for customers requiring high-reliability electronic assemblies. Located in Tempe, Ariz., it offers full-service engineering and production of hybrid circuit, MCM (multichip module) technologies, chip on board and custom packaging solutions. The company produces specialized through-hole and mixed-technology assemblies for use in down-hole, military, medical, agricultural and high-grade industrial applications. It also specializes in SMT processing of high-temperature solder alloys and placement of fine-pitch SOICs and micro BGA components.