Fico of America
Besi is a leading provider of assembly processes and equipment for packaging applications in various industries, including electronics, automotive, and solar energy. They develop cutting-edge technologies for leadframe, substrate, and wafer level packaging, catering to the needs of diverse end-user markets.
With a focus on innovation and advanced manufacturing techniques, Besi offers a wide range of products and services, including die bonding, flip chip, molding, plating, and cleaning solutions. Their commitment to quality and customer satisfaction has made them a trusted name in the semiconductor equipment industry.
Generated from the website
Also at this address
You might also like
Partial Data by Infogroup (c) 2025. All rights reserved.
Partial Data by Foursquare.