Benchmark Electronics

First Electronics, Inc. is an ISO-9001 2008 ISO 13485 compliant Electronic Contract Manufacturing company that offers quality contract manufacturing services to various industries. Specializing in SMT Assembly, Circuit Board Assembly, and PCB Assembly, they provide comprehensive solutions for electronic manufacturing needs. With a commitment to quality and compliance, First Electronics, Inc. ensures that their services meet industry standards and requirements. Their expertise in electronic manufacturing makes them a trusted partner for businesses seeking reliable and efficient manufacturing solutions. Generated from their website's infomation

Founded in 1960, Microsemi Corporation specializes in system-engineered analog mixed-signal integrated circuits and high-reliability semiconductors. Its principal markets include implanted medical, defense, aerospace and satellite, notebook computers, monitors and LCD televisions, automotive, mobile connectivity, industrial power switching and communications applications that include power over Ethernet systems. Microsemi Corporation employs more than 2,000 people and received several awards and recognition. The company has a long history of profitability, improving margins, a strong balance sheet and business development plans that include investing in new facilities both domestically and abroad. Its customers include Honeywell, GE, HP, Raytheon, Dell, LG, Lockheed, Seagate, Boeing, Boston Scientific and Medtronic.

Since 1980, HDA/SMC has been providing a full-service contract manufacturing solutions for customers requiring high-reliability electronic assemblies. Located in Tempe, Ariz., it offers full-service engineering and production of hybrid circuit, MCM (multichip module) technologies, chip on board and custom packaging solutions. The company produces specialized through-hole and mixed-technology assemblies for use in down-hole, military, medical, agricultural and high-grade industrial applications. It also specializes in SMT processing of high-temperature solder alloys and placement of fine-pitch SOICs and micro BGA components.